Mobile phone radiator semiconductor back clip patch refrigeration physical cooling artifact aluminum alloy adhesive heat conduction heat transfer plate

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Mobile phone radiator semiconductor back clip patch refrigeration physical cooling artifact aluminum alloy adhesive heat conduction heat transfer plate

Color :

Mobile phone heat sink Magnetic suction flat hot plate Clip uniform hot plate

QTY

FOB PRICE
CIF PRICE

Please contact the supplier to get the latest CIF price
QUANTITY

-

+

PCS
TOTAL COST
$1660

Specification

Brand : Zhi Shengxing,Mobile phone heat sink,Mobile phone heat sink,2022,Spot,Mobile Phone,Apple/Huawei,Heat sink,Aluminum,None,None,None,Reuse,Heat sink,None,None,Other,1-3 days,Support,Invoice Not provided,Seven days without reason.,Bulk,Mobile Phone,Mobile phone heat sink,Magnetic suction flat hot plate,Clip uniform hot plate,ebay,Amazon,wish,AliExpress,Independent Station,LAZADA,Europe,South America,North America,Yes

Material : Default

Packing Information

Pcs/Carton : N/A	Packing Size/Carton : N/A	Packing Vol/Carton : N/A
N.W./Carton : N/A	G.W./Carton : N/A	QTY in 40HQ : N/A
QTY in 40GP : N/A	QTY in 20GP : N/A

Product Introduction

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• If products are not as described, returns are accepted and return shipping fee should be paid by buyer.

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